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The FRAMOS® Group, a global supplier of imaging products, custom vision solutions, and OEM services, is announcing that its spin-off FRAMOS AI will become cubemos. The cubemos entity focuses on Deep Learning and AI development, helping industrial customers to integrate leading-edge AI vision solutions.
Sunex is one of our top-level suppliers when it comes to miniature lenses for embedded vision. The California based lens specialist is known for its high-quality solutions for demanding indoor and outdoor applications in embedded vision, automotive, autonomous vehicles, and, surveillance. They provide a wide range of M12, M8 and ultra-compact lenses. Compare the latest Sunex lenses for Embedded Vision!
ON Semiconductor has announced to discontinuing the production of CCD image sensors. Last time buy date will be March 18, 2020. All CCD Sensors (KAI, KAF, KAE, KLI, KAC) by ON Semiconductor are impacted by this end-of-life. The former Kodak CCD facility in Rochester, US, will then cease operations in June 2020. The FRAMOS sensor experts are available to advise and support for any questions regarding last orders, replacement options and any sensor evaluations.
ON Semiconductor has expanded its high-performance XGS family of Global Shutter CMOS image sensors with two new models; the XGS 9400 and the XGS 8000. These devices provide resolutions of 9.4 and 8.8 Megapixels respectively in a compact package, achieving high-speed performance in a single form factor. Both models contain a rich feature set and are particularly suited for integration into 29 x 29 mm2-cameras for Machine Vision, ITS, Security, Medical and Scientific applications.
Sony Semiconductor Solutions has launched a new image sensor for surveillance cameras, factory automation applications, and industrial environments. The IMX485 provides Sony’s STARVIS™ technology for excellent visibility in low light. It combines high sensitivity with high-speed, which makes the IMX485 a great solution in challenging environments for industrial inspection systems.
Framos AI GmbH, a member of the FRAMOS® Group, leading global supplier of imaging products, custom vision solutions and OEM services, is launching its FAIM SDK to enable AI powered algorithms optimized for real-time applications.
FRAMOS, the global partner for Vision Technologies, has developed an industrial grade version of Intel’s® RealSense™ Suite to provide Gigabit Ethernet connectivity and an IP66 rated housing. The D435e industrial 3D GigE Vision camera leverages the advantages of easy-to-integrate 3D vision in rugged environments; enabling real-time positioning, orientation and tracking of robots, automated guided vehicles, and smart machines.
An evening spent with cold drinks and a bouncy castle! More than 90 employees celebrated Summer at the FRAMOS Summer party with their families and partners. Twenty-four children blew soap bubbles and streamers into the evening, and jumped on a red fire brigade bouncy castle.
The SED-100A holographic waveguide display enhances customized hardware AR development for industrial applications with high precision and quality.
Sony Semiconductor Solutions launches a new image sensor for compact security applications. The IMX415 combines the STARVIS™ technology for excellent visibility in low light surveillance with new “Prior Low Noise Circuit” (PLNC) technology for better SNR. The IMX415 is a very compact candidate for low light applications in security and for challenging environments in industrial and factory automation.
FRAMOS announces a global partnership with 96boards, the leading technology frontier in open platform specification and compliance, to comprehensively connect the FRAMOS Embedded Vision line of sensor modules for efficient vision development.
The fourth FRAMOS® Tech Days event was a complete success - 96% of the participants were satisfied or very satisfied with this technology platform for vision developers. Throughout the two-day event, Sony Japan, Intel, ON Semiconductor, and other FRAMOS partners were on-hand. They presented the latest technologies in the fields of image sensors and embedded vision, 3D imaging, artificial intelligence, and image processing in Munich, Germany May 22-23, 2019.
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