Supporting Security Applications with Sony’s Highly Sensitive Starvis IMX335 Sensor

Sony Semiconductor Solutions recently launched its new IMX335 image sensor for security applications and select industrial and factory automation type applications. Available from global imaging expert FRAMOS, the 1/2.8" imager offers a resolution of 5 megapixels at a pixel size of 2µm. This sensor has a back side illuminated pixel architecture providing high sensitivity with frame rates of up to 60 frames per second through a MIPI interface which provides excellent image quality and speed needed for embedded vision integration.

The IMX335 CMOS sensor has a 6.52mm diagonal providing 5MP resolution with a 2592 (H) x 1944 (V) effective image size while keeping the power consumption low. The Sony Starvis back side illuminated pixel technology used on this chip allows for high sensitivity in the visible light and near infrared spectrums making it ideal for security and surveillance applications.

Sibel Yorulmaz-Cokugur, Sensor Expert at FRAMOS, says: “Different readout modes support advanced surveillance options and a further improved picture quality. The horizontal/vertical 2x2 line binning mode, for example, allows the summing of neighboring pixels to provide a “super pixel” that is brighter and can provide more information, especially under low light conditions. This is an important feature in security and surveillance applications as they are often used in ranging lighting conditions, both indoors and outdoors, with no way to improve the brightness of the captured images with external illumination.”

Features like a dynamic range up to 72dB, advanced HDR functions and digital overlap HDR further improve the image quality and contrast behavior allowing for more detailed image analysis. These features when combined with the low dark current performance and no smear further improve its performance in applications looking at both bright and dark regions at once. The IMX335 is available in both monochrome and color versions.

The IMX335 features a small 7.3mm (H) x 7.1 mm (V) CSP package and provides MIPI CSI-2 serial data output for easy integration in Embedded Vision projects. Evaluation samples are available from FRAMOS, with mass production starting in Q1/2019.

The industry and product experts at FRAMOS are available to support customers with the integration of these new sensors into their applications and projects. FRAMOS also offers a complete and small-footprint sensor module based on the Sony IMX335, pre-soldered on a PCB with a standardized connector with enough circuit conditioning to get the sensor up and running quickly. The module also includes a matching lens and lens mount already assembled. The IMX335 module is part of the FRAMOS ecosystem of sensor modules and interchangeable connectors, that provide engineers and developers with ready-to-use compositions to speed time-to-market and optimize resources. In addition, FRAMOS provides a broad range of support services for development, customization, and logistics.

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The FRAMOS Imaging Team
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